Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Heat Sink Passive BGA Parallel Array Wing Adhesive Aluminum Black Anodized
immediatamente
Ships
Heat Sink Passive D PAK/TO-252 SMD Aluminum 25°C/W Tin
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Heat Sink Passive BGA Pin Array Aluminum Black Anodized
Heat Sink Passive Aluminum Alloy 0.13°C/W Black Anodized
Heat Sink Passive Vertical Aluminum Clear Trivalent Chromate
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized
Heat Sink Passive TO-218/TO-220/TO-247 Solderable Wave Aluminum 2.7 °C/W Black Anodized
Straight Sintered Heat Pipes
Heatsink Assembly Intel LGA2011