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44764-2401

Molex / Waldom

Conn Wire to Board RCP 24 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

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RoHS Compliant
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Conn Wire to Board RCP 24 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray
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  • Product Attribute
    Attribute Value Select Attribute
  • satıcı:
    Molex / Waldom
  • Parça Numarası:
    44764-2401
  • Ölçü Birimi:
    Per Each
  • RoHS :
    Yes
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
  • Type:
    Wire to Board
  • Body Orientation:
    Right Angle
  • Gender:
    RCP
  • Mounting:
    Through Hole
  • Pitch:
    3 mm
  • Number of Contacts:
    24
  • Maximum Voltage Rating:
    600 V
  • Maximum Current Rating:
    5/Contact A
  • Termination Method:
    Solder
  • Operating Temperature:
    -40 to 105 °C
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
Stokta: 2.775
Ships today, if you order in
MİN SİPARİŞ:
15
17 Weeks Gemi olabilir 3.13.25
Sepete ekle
MİKTAR
Unit Price
15
$7.31
60
$7.17
150
$7.07
250
$6.21
1.440
$5.32
2.500
$5.24
5.000 +
$5.16
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