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375424B00034G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized

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RoHS Compliant
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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Search Keywords: 375424B00034G
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  • Product Attribute
    Attribute Value Select Attribute
  • satıcı:
    Boyd Laconia LLC
  • Parça Numarası:
    375424B00034G
  • Ölçü Birimi:
    Per Each
  • RoHS :
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    3360
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    15.2 x 15.2 x 6.356714mm
  • Thermal Resistance:
    62.56717°C/W
  • Finish:
    Black Anodized6710
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Stokta: 103
Ships today, if you order in
SİPARİŞ ÜZERİNE:
3.360   Gemi olabilir 2.26.25
MİN SİPARİŞ:
25
17 Weeks Gemi olabilir 3.25.25
Sepete ekle
MİKTAR
Unit Price
25
$1.26
100
$1.10
250
$0.97
500
$0.92
1.000
$0.87
3.360
$0.83
6.720
$0.77
10.080 +
$0.73
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