Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Inductor RF Chip Wirewound 0.0039uH 5% 250MHz 20Q-Factor Ceramic 0.7A 0.08Ohm DCR 0603 T/R
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Ships
Inductor RF Chip Wirewound 0.00668uH 2% 250MHz 25Q-Factor Ceramic 0.7A 0.11Ohm DCR 0603 T/R
Inductor RF Chip Wirewound 0.0985uH 2% 150MHz 34Q-Factor Ceramic 0.4A 0.58Ohm DCR 0603 T/R
Inductor RF Chip Wirewound 0.012uH 2% 250MHz 30Q-Factor Ceramic 0.7A 0.13Ohm DCR 0603 T/R
Inductor RF Chip Wirewound 0.122uH 2% 150MHz 33Q-Factor Ceramic 0.3A 0.65Ohm DCR 0603 T/R
Inductor RF Chip Wirewound 0.015uH 2% 250MHz 30Q-Factor Ceramic 0.7A 0.17Ohm DCR 0603 T/R
Inductor RF Chip Wirewound 0.022uH 2% 250MHz 35Q-Factor Ceramic 0.7A 0.19Ohm DCR 0603 T/R
Inductor RF Chip Wirewound 0.22uH 2% 100MHz 25Q-Factor Ceramic 0.2A 1.9Ohm DCR 0603 T/R
Inductor RF Chip Wirewound 0.033uH 2% 250MHz 35Q-Factor Ceramic 0.6A 0.22Ohm DCR 0603 T/R
Inductor RF Chip Wirewound 0.047uH 2% 200MHz 35Q-Factor Ceramic 0.6A 0.28Ohm DCR 0603 T/R
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