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BDN09-3CB/A01 by cts corporation
Image is representational - see mfr. specs

BDN09-3CB/A01

CTS Corporation

Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized

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Datasheet Accessories Notify Me

RoHS Compliant
Tray Packaging
Certificate of Compliance Guarantee
Description +
Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized
Search Keywords: BDN093CBA01
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    CTS Corporation
  • Part No:
    BDN09-3CB/A01
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8473305100
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1232
  • Device Cooled:
    BGA,PGA,PLCC,QFP
  • Attachment Method:
    Adhesive Tape
  • Dimension:
    23.114 x 23.114 x 9.017 mm
  • Thermal Resistance:
    26.9 °C/W
  • Finish:
    Black Anodized
Tools/3D Models +
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 1,232
Can Ship immediately
Minimum Order:
10
10 Weeks can ship 2/3/25
ADD TO CART
Qty
Unit Price
10
$2.84
100
$2.33
250
$2.24
500
$2.15
1,232
$2.07
3,696
$1.77
6,160
$1.69
8,624 +
$1.66
Suppliers Standard Package
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