RECOM’s 3D Power Packing
RECOM Power's new DC/DC converter modules employ 3D assembly to utilize the Z-axis. These modules seamlessly integrate into SMT assembly, mimicking standard component processes. They maintain a slim profile that suits modern devices. A compact footprint is vital to preserve module benefits over discrete designs.
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RPMx: The RPMB/RPMH series illustrates a 30W component housed within a thermally-improved LGA package with 25 pads. The package dimensions measure 11.7mm x 12.19mm x 3.75mm in height. This high-power density is made possible through a multi-layer internal PCB that employs plugged and blind vias.
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RPX: The RPX series features high-density footprints in thermally enhanced QFN packages and operate up to 85°C without forced air cooling. The 1A and 1.5A versions in 3mm x 5mm x 1.6mm QFN packages support input voltages from 4VDC to 36VDC, accommodating 5V, 12V, 15V, or unregulated 24VDC supplies.
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RPL: The RPL-3.0 series offers input flexibility from 3V to 18V, a maximum 3000mA output, and efficiency reaching up to 89%. These buck converters, complete with integrated inductors, reside in a compact 3mm x 3mm x 1.45mm thermally enhanced LGA package.
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RxxCT(E) and RxxC05TE: The RxxCT(E) and RxxC05TE series employ an ultra-low profile with isolation voltages of up to 5k VAC/1min and reinforced 2MOPP isolation. The overall component height renders them apt for card-type applications where the converter's isolation height aligns with surrounding SMT components.
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Introducing RECOM 3D Power Packaging® (3DPP)
