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BDN09-3CB/A01 by cts corporation
Image is representational - see mfr. specs

BDN09-3CB/A01

CTS Corporation

Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized

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説明 +
Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized
Search Keywords: BDN093CBA01
仕様 +
  • Product Attribute
    Attribute Value Select Attribute
  • サプライヤー:
    CTS Corporation
  • 部品番号:
    BDN09-3CB/A01
  • 測定単位:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8473305100
  • COO:
    CN
  • ECCN:
    EAR99
  • サプライヤー標準パック This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1232
  • Device Cooled:
    BGA,PGA,PLCC,QFP
  • Attachment Method:
    Adhesive Tape
  • Dimension:
    23.114 x 23.114 x 9.017 mm
  • Thermal Resistance:
    26.9 °C/W
  • Finish:
    Black Anodized
Tools/3D Models +
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We’ll meet or beat any authorized competitor’s published price for this part.
在庫: 1,232
Ships today, if you order in
最小注文:
10
10 Weeks 出荷できます 12/20/24
45ドルフラットレート配送:
カートに追加
数量
Unit Price
10
$2.84
100
$2.33
250
$2.24
500
$2.15
1,232
$2.07
3,696
$1.77
6,160
$1.69
8,624 +
$1.66
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