Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Fuse Chip Slow Blow Acting 4A 32V SMD Solder Pad 1206 Ceramic T/R UL
immediatamente
Ships
Fuse Chip Slow Blow Acting 2A 63V SMD Solder Pad 1206 T/R UL
Fuse Chip Slow Blow Acting 2.5A 32V SMD Solder Pad 1206 T/R UL
Fuse Chip Slow Blow Acting 3A 32V SMD Solder Pad 1206 Ceramic T/R UL
Fuse Chip Slow Blow Acting 7A 24V SMD Solder Pad 1206 T/R UL
Fuse Chip Slow Blow Acting 5A 24V SMD Solder Pad 1206 T/R UL
1206 SMD High-Inrush Multilayer 6.0A
Fuse Chip Slow Blow Acting 1.5A 63V SMD Solder Pad 1206 T/R UL
Fuse Chip Fast Acting 0.5A 65V SMD Solder Pad 0603 T/R
Ships 1/27/25
0603 SMD High-Inrush Thin-Film 0.5A