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375324B00035G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4°C/W Black Anodized

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Descrizione +
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4°C/W Black Anodized
Search Keywords: 375324B00035G
Specifiche +
  • Product Attribute
    Attribute Value Select Attribute
  • fornitore:
    Boyd Laconia LLC
  • Codice componente:
    375324B00035G
  • Unità di misura:
    per Each
  • RoHS :
    Yes
  • COO:
    CN
  • Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1920
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    10.2 x 10.2 x 10.26714mm
  • Thermal Resistance:
    71.46717°C/W
  • Finish:
    Black Anodized6710
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in magazzino: 0
su ordine:
1.920   Può spedire 2/26/25
MOQ per Qtà in magazzino:
5
MOQ per Qtà fuori stock:
480
19 Weeks Può spedire 4/1/25
Aggiungi al carrello
QTÀ
Prezzo unitario
5
€8.749
100
€5.650
250
€5.361
480
€5.308
960
€5.255
1.440
€5.202
1.920 +
€5.150
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