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BDN09-3CB/A01

CTS Corporation

Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized

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Description +
Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized
Search Keywords: BDN093CBA01
spécification +
  • Product Attribute
    Attribute Value Select Attribute
  • fournisseur:
    CTS Corporation
  • Référence:
    BDN09-3CB/A01
  • Unité de mesure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8473305100
  • COO:
    CN
  • ECCN:
    EAR99
  • Référence This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1232
  • Device Cooled:
    BGA,PGA,PLCC,QFP
  • Attachment Method:
    Adhesive Tape
  • Dimension:
    23.114 x 23.114 x 9.017 mm
  • Thermal Resistance:
    26.9 °C/W
  • Finish:
    Black Anodized
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en stock: 1,232
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Commande min:
10
10 Weeks Peut expédier 1/27/25
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Prix unitaire
10
€2.963
100
€2.431
250
€2.337
500
€2.243
1 232
€2.159
3 696
€1.846
6 160
€1.763
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€1.732
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