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374024B00035G

Boyd Laconia LLC

Heat Sink Passive BGA Pin Array Adhesive Aluminum 40°C/W Black Anodized

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Description +
Heat Sink Passive BGA Pin Array Adhesive Aluminum 40°C/W Black Anodized
Search Keywords: 374024B00035G
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  • Product Attribute
    Attribute Value Select Attribute
  • fournisseur:
    Boyd Laconia LLC
  • Référence:
    374024B00035G
  • Unité de mesure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • Référence This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1078
  • Device Cooled:
    BGA
  • Attachment Method:
    Tape
  • Dimension:
    23 x 23 x 10 mm
  • Thermal Resistance:
    40 °C/W
  • Finish:
    Black Anodized
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en stock: 2,544
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Commande min:
10
14 Weeks Peut expédier 3/4/25
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Prix unitaire
10
€3.402
50
€2.856
250
€2.636
500
€2.531
1 078
€2.426
3 234
€2.174
5 390
€2.058
7 546 +
€2.027
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