Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Heat Sink Passive Pin Array Adhesive 16.1°C/W Black Anodized
Ships Immediately
can ship
Heat Sink - Assorted (BGA - LGA - CPU - ASIC...) - 4.50°C/W @ 400 LFM - 13.50°C/W Natural - Aluminum - Black Anod ...
Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized
Heat Sink Passive TO-126/TO-127/TO-220 Horizontal Screw Mount 27.3°C/W Black Anodized
Heat Sink Passive Screw Mount Aluminum Black Anodized
Heat Sink Passive Pin Array Adhesive 26.4°C/W Black Anodized
Heat Sink For Metal And Plastic Case - TO-3 Semiconductor Case Type - 10.4 Ø °C/W.
can ship 2/12/25
APF Low-Profile Forged Heatsink 26 x 4 Plate Fin Matrix 10.1°C/Watt Thermal Resistance
Thermal Link Retainer with BeO Insulator Dull Nickel Finish 4-40 Hex Nut Mount TO-5 Semiconductor Case
Heat Sink - Passive - TO-3 - Finger - 10.4C/W - Black Anodized - Stud Mount.