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375424B00034G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized

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RoHS Compliant
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Description +
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Search Keywords: 375424B00034G
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    375424B00034G
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    3360
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    15.2 x 15.2 x 6.356714mm
  • Thermal Resistance:
    62.56717°C/W
  • Finish:
    Black Anodized6710
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We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 103
Ships today, if you order in
On Order:
3,360   can ship 2/26/25
Minimum Order:
25
17 Weeks can ship 3/20/25
ADD TO CART
Qty
Unit Price
25
$1.26
100
$1.10
250
$0.97
500
$0.92
1,000
$0.87
3,360
$0.83
6,720
$0.77
10,080 +
$0.73
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