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375324B00035G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4°C/W Black Anodized

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RoHS Compliant
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Description +
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4°C/W Black Anodized
Search Keywords: 375324B00035G
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    375324B00035G
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • COO:
    CN
  • Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1920
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    10.2 x 10.2 x 10.26714mm
  • Thermal Resistance:
    71.46717°C/W
  • Finish:
    Black Anodized6710
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 0
On Order:
1,920   can ship 2/26/25
MOQ for In Stock Qty:
5
MOQ for out of Stock Qty:
480
19 Weeks can ship 4/3/25
ADD TO CART
Qty
Unit Price
5
$9.05
100
$8.60
250
$8.17
480
$7.76
960
$4.11
1,440
$2.89
1,920 +
$2.83
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Item may be subject to tariff fee if shipping within the United States
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