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658-60AB

Wakefield

Heat Sink Passive BGA Pin Array Adhesive Black Anodized

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RoHS Compliant
Packaging
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Description +
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Search Keywords: 65860AB
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Wakefield
  • Part No:
    658-60AB
  • Alias/AKA:
    65860AB
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    7616995090
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    700
  • Device Cooled:
    BGA
  • Attachment Method:
    Adhesive
  • Dimension:
    27.9 x 27.9 x 15.2 mm
  • Thermal Resistance:
    N/A
  • Finish:
    Black Anodized
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 2,631
Can Ship immediately
Minimum Order:
25
14 Weeks can ship 2/28/25
ADD TO CART
Qty
Unit Price
25
$1.172
250
$0.964
700
$0.924
1,400
$0.887
2,800
$0.773
5,600
$0.754
7,700
$0.743
10,500 +
$0.668
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Item may be subject to tariff fee if shipping within the United States