DSPIC30F6012A-30I/PT by microchip technology

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DSPIC30F6012A-30I/PT

Microchip Technology

MCU - 16-bit dsPIC RISC - 144KB Flash - 8KB SRAM - 4KB EEPROM - -40°C to +85°C - 2.5V/3.3V/5V - 64-Pin TQFP - Tray

Datenblatt Zubehör Notify Me

RoHS-konform

TRAY Verpackung

Certificate of Compliance Guarantee

This product may require extra documentation. Shipping may be delayed 1-2 days.

Beschreibung +

MCU - 16-bit dsPIC RISC - 144KB Flash - 8KB SRAM - 4KB EEPROM - -40°C to +85°C - 2.5V/3.3V/5V - 64-Pin TQFP - Tray

Search Keywords: DSPIC30F6012A30IPT

Spezifizierung +

Product Attribute

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Lieferant:

Microchip Technology
Artikelnummer:

DSPIC30F6012A-30I/PT
Maßeinheit:

Per Each
RoHS (Beschränkung gefährlicher Stoffe):

Yes
HTS:

8542310020
COO:

TH
ECCN:

3A991.a.2
Standardmenge

160
Program Memory Size:

144 KB
Program Memory Type:

Flash
Number of Programmable I/Os:

52
Operating Temperature:

-40 to 85 °C
ADC Resolution:

12 bit
RAM Size:

8 KB

Tools/3D Models +

EE-WERKZEUGKASTEN

Ressourcen +

Datenblatt

Product Changes +

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 11-Feb-2010 - ERRATA-DSPIC30F6011/6012/6013/6014 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 11-Nov-2004 - Product Change Notice

PCN - 27-Jul-2011 - Microchip is announcing the qualification of 64L, 80L, and 100L TQFP (14x14) packages with C7025 lea

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 07-Jun-2011 - ERRATA-DSPIC30F6011A/6012A/6013A/6014A FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION ERRATA DOC

PCN - 04-Feb-2011 - Microchip has released a new devicedoc for the dsPIC30F6011A/6012A/6013A/6014A data sheet of devices

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 14-Dec-2011 - Microchip is announcing the qualification of 64L, 80L, and 100L TQFP (14x14) packages with C7025 lea

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. Siehe Alternative
Different product options available. Siehe Alternative
Different packageing options available. Siehe Alternative
Possible Replacement options available. Siehe Alternative
Item discontinued
End of Life: Final orders must be placed by
Item discontinued

Vorrätig: 721

Versand heute, if you order in

BESTAND DES HERSTELLERS:

31 360 Kan verzenden 12.2.24

MOQ für In-Stock-Menge:

MOQ für Out-of-Stock-Menge:

200

LIEFERZEIT AB PRODUKTION:

4 Weeks Kan verzenden 12.17.24

MENGE

Stückpreis

€11.601

€11.258

100

€10.925

200

€10.759

400

€10.593

600

€10.437

800 +

€10.281

Anmeldung um Sonderpreise freizuschalten

DSPIC30F6012A-30I/PT

Microchip Technology

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