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BDN09-3CB/A01

CTS Corporation

Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized

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Beschreibung +
Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9°C/W Black Anodized
Search Keywords: BDN093CBA01
Spezifizierung +
  • Product Attribute
    Attribute Value Select Attribute
  • Lieferant:
    CTS Corporation
  • Artikelnummer:
    BDN09-3CB/A01
  • Maßeinheit:
    Per Each
  • RoHS (Beschränkung gefährlicher Stoffe):
    Yes
  • HTS:
    8473305100
  • COO:
    CN
  • ECCN:
    EAR99
  • Standardmenge This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1232
  • Device Cooled:
    BGA,PGA,PLCC,QFP
  • Attachment Method:
    Adhesive Tape
  • Dimension:
    23.114 x 23.114 x 9.017 mm
  • Thermal Resistance:
    26.9 °C/W
  • Finish:
    Black Anodized
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
Vorrätig: 1,232
Versand heute, if you order in
MINIMALE BESTELLING:
10
10 Weeks Kan verzenden 1.27.25
In den Einkaufswagen
MENGE
Stückpreis
10
€2.963
100
€2.431
250
€2.337
500
€2.243
1 232
€2.159
3 696
€1.846
6 160
€1.763
8 624 +
€1.732
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