Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Heat Sink Passive D PAK/TO-252 SMD Aluminum 25°C/W Tin
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Heat Sink Passive TO-220 Straight Thru-Hole Copper 12.5C/W Black Paint
Heat Sink Passive TO-220 Radial Clip Aluminum 5°C/W Black Anodized
31.0 x 31.0 x 17.5 mm BGA Heat Sink - High Performance maxiFLOW/superGRIP Heat Sink Clip Anodized Aluminum
40.0 x 40.0 x 24.5 mm BGA Heat Sink High Performance Straight Fin with adhesive thermal tape Black Anodized Alum ...
HEAT SINK SFP DWDM 6.5mm TALL
Heatsink Assembly Intel LGA2011
Finger-shaped-heatsink - 8K/W - 36x33x11.94mm - black anodized - with solderpins - for TO-220, TO-247
Heat Sink - TO-202 - Aluminum - 1.0W @ 30°C - Board Level - Black Anodized.
Heat Sinks Extrusion, 61820-8 Foot Bar (96.5 Inch)
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