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44764-0802

Molex / Waldom

Conn Wire to Board RCP 8 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

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RoHS Compliant
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Descrição +
Conn Wire to Board RCP 8 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray
Search Keywords: 447640802
especificação +
  • Product Attribute
    Attribute Value Select Attribute
  • fornecedor:
    Molex / Waldom
  • Número do item:
    44764-0802
  • Unidade de medida:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8536694040
  • COO:
    US
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
  • Type:
    Wire to Board
  • Body Orientation:
    Right Angle
  • Gender:
    RCP
  • Mounting:
    Through Hole
  • Pitch:
    3 mm
  • Number of Contacts:
    8
  • Maximum Voltage Rating:
    600 V
  • Maximum Current Rating:
    5/Contact A
  • Termination Method:
    Solder
  • Operating Temperature:
    -40 to 105 °C
Tools/3D Models +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
Backordered, But More coming soon
min Ordem:
20
17 Weeks Pode enviar 2/6/25
Pedido em espera
QTD
Unit Price
20
$5.68
260
$4.54
520
$4.10
1 040
$4.06
2 500
$3.90
5 000
$3.86
10 000 +
$3.82
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